|
8mm DIP Round LED without Flange
|
Part Number
|
Chip
|
Lens Color
|
Vf(V)
IF=20mA
|
Iv(mcd)
IF=20mA
|
|
Emitted Color
|
λd(nm) |
Typ
|
Max
|
Min
|
Typ
|
| HI-08B3ORWBC |
Red
|
620-645
|
Water Clear
|
1.8
|
2.4
|
800
|
2400
|
| HI-08B3YGWBC |
Kelly
|
565-575
|
Water Clear
|
1.8
|
2.4
|
600
|
2000
|
| HI-08B3SYWBC |
Yellow
|
585-595
|
Water Clear
|
1.8
|
2.4
|
650
|
2400
|
| HI-08B3AYWBC |
Amber
|
600-615
|
Water Clear
|
1.8
|
2.4
|
800
|
2500
|
| HI-08B3SBWBC |
Blue
|
455-475
|
Water Clear
|
3.0
|
3.8
|
1000
|
2800
|
| HI-08B3SWWBC |
White
|
X: 0.26-0.33
Y: 0.27-0.34
|
Water Clear
|
3.0
|
3.6
|
2000
|
18000
|
|
|
| HI-08B3ORWBT |
Red
|
620-645
|
Red Transparent
|
1.8
|
2.4
|
800
|
2400
|
| HI-08B3YGWBT |
Kelly
|
565-575
|
Kelly Transparent
|
1.8
|
2.4
|
600
|
2000
|
| HI-08B3SYWBT |
Yellow
|
585-595
|
Yellow Transparent
|
1.8
|
2.4
|
650
|
2400
|
| HI-08B3AYWBT |
Amber
|
600-615
|
Amber Transparent
|
1.8
|
2.4
|
800
|
2500
|
| HI-08B3SBWBT |
Blue
|
455-475
|
Blue Transparent
|
3.0
|
3.8
|
1000
|
2800
|
|
|
| HI-08B3ORWBE |
Red
|
620-645
|
Red Diffused
|
1.8
|
2.4
|
200
|
600
|
| HI-08B3YGWBE |
Kelly
|
565-575
|
Kelly Diffused
|
1.8
|
2.4
|
240
|
700
|
| HI-08B3SYWBE |
Yellow
|
585-595
|
Yellow Diffused
|
1.8
|
2.4
|
200
|
700
|
| HI-08B3AYWBE |
Amber
|
600-615
|
Amber Diffused
|
1.8
|
2.4
|
180
|
650
|
| HI-08B3SBWBE |
Blue
|
455-475
|
Blue Diffused
|
3.0
|
3.8
|
250
|
800
|
|
|
| HI-08B3ORWBD |
Red
|
620-645
|
White Diffused
|
1.8
|
2.4
|
200
|
600
|
| HI-08B3YGWBD |
Kelly
|
565-575
|
White Diffused
|
1.8
|
2.4
|
240
|
700
|
| HI-08B3SYWBD |
Yellow
|
585-595
|
White Diffused
|
1.8
|
2.4
|
200
|
700
|
| HI-08B3AYWBD |
Amber
|
600-615
|
White Diffused
|
1.8
|
2.4
|
180
|
650
|
| HI-08B3SBWBD |
Blue
|
455-475
|
White Diffused
|
3.0
|
3.8
|
250
|
800
|
| HI-08B3SWWBD |
White
|
X: 0.26-0.33
Y: 0.27-0.34
|
White Diffused
|
3.0
|
3.6
|
350
|
1000
|
Absolute Maximum Rating3 Ta=25℃
|
Descriptions
|
Symbol
|
Value
|
Unit
|
|
Continous Forward Current
|
IF
|
20
|
mA
|
|
Reverse Voltage
|
VR
|
5
|
V
|
| Power Dissipation |
Pd |
50~80 |
mA |
|
Operating Temperature
|
Topy
|
-25 ~ +85
|
℃
|
|
Storage Temperature
|
Tstg
|
-35 ~ +85
|
℃
|
|
Soldering Temperature*2
|
Tsol
|
260±5(for≤5sec)
|
℃
|
*1 Daty ratio=1/10 Pulse Width=0.1ms
*2 At the Position of 2mm from the bottom face of resin Package within 5sec
|
