|
3mm DIP Concave LED without Flange
|
Part Number
|
Chip
|
Lens Color
|
Vf(V)
IF=20mA
|
Iv(mcd)
IF=20mA
|
|
Emitted Color
|
λd(nm) |
Typ
|
Max
|
Min
|
Typ
|
| HI-03Q3ORDBC |
Red
|
620-645
|
Water Clear
|
1.8
|
2.4
|
120
|
300
|
| HI-03Q3YGDBC |
Kelly
|
565-575
|
Water Clear
|
1.8
|
2.4
|
140
|
250
|
| HI-03Q3SYDBC |
Yellow
|
585-595
|
Water Clear
|
1.8
|
2.4
|
160
|
300
|
| HI-03Q3AYDBC |
Amber
|
600-615
|
Water Clear
|
1.8
|
2.4
|
150
|
300
|
| HI-03Q3SBDBC |
Blue
|
455-475
|
Water Clear
|
3.0
|
3.8
|
100
|
3000
|
| HI-03Q3SWDBC |
White |
X: 0.26-0.33
Y: 0.27-0.34
|
Water Clear |
3.0 |
3.6 |
1000 |
4000 |
| HI-03Q3SGDBC |
Green
|
510-530
|
Water Clear
|
2.8
|
3.6
|
2000
|
6000
|
| |
| HI-03Q3ORDBT |
Red
|
620-645
|
Red Transparent
|
1.8
|
2.4
|
25
|
60
|
| HI-03Q3YGDBT |
Kelly
|
565-575
|
Kelly Transparent
|
1.8
|
2.4
|
25
|
55
|
| HI-03Q3SYDBT |
Yellow
|
585-595
|
Yellow Transparent
|
1.8
|
2.4
|
30
|
80
|
| HI-03Q3AYDBT |
Amber
|
600-615
|
Amber Transparent
|
1.8
|
2.4
|
30
|
60
|
| HI-03Q3SBDBT |
Blue
|
455-475
|
Blue Transparent
|
3.0
|
3.8
|
40
|
100
|
| |
| HI-03Q3ORDBE |
Red
|
620-645
|
Red Diffused
|
1.8
|
2.4
|
40
|
100
|
| HI-03Q3YGDBE |
Kelly
|
565-575
|
Kelly Diffused
|
1.8
|
2.4
|
20
|
80
|
| HI-03Q3SYDBE |
Yellow
|
585-595
|
Yellow Diffused
|
1.8
|
2.4
|
30
|
60
|
| HI-03Q3AYDBE |
Amber
|
600-615
|
Amber Diffused
|
1.8
|
2.4
|
20
|
60
|
| |
| HI-03Q3ORDBD |
Red
|
620-645
|
White Diffused
|
1.8
|
2.4
|
12
|
70
|
| HI-03Q3YGDBD |
Kelly
|
565-575
|
White Diffused
|
1.8
|
2.4
|
15
|
70
|
| HI-03Q3SYDBD |
Yellow
|
585-595
|
White Diffused
|
1.8
|
2.4
|
15
|
75
|
| HI-03Q3AYDBD |
Amber
|
600-615
|
White Diffused
|
1.8
|
2.4
|
18
|
80
|
| HI-03Q3SBDBD |
Blue
|
455-475
|
White Diffused
|
3.0
|
3.8
|
30
|
120
|
| HI-03Q3SWDBD |
White
|
X: 0.26-0.33
Y: 0.27-0.34
|
White Diffused
|
3.0
|
3.6
|
50
|
150
|
Absolute Maximum Rating3 Ta=25℃
|
Descriptions
|
Symbol
|
Value
|
Unit
|
|
Continous Forward Current
|
IF
|
20
|
mA
|
|
Reverse Voltage
|
VR
|
5
|
V
|
| Power Dissipation |
Pd |
50~80 |
mA |
|
Operating Temperature
|
Topy
|
-25 ~ +85
|
℃
|
|
Storage Temperature
|
Tstg
|
-35 ~ +85
|
℃
|
|
Soldering Temperature*2
|
Tsol
|
260±5(for≤5sec)
|
℃
|
*1 Daty ratio=1/10 Pulse Width=0.1ms
*2 At the Position of 2mm from the bottom face of resin Package within 5sec
|
